MSI H6M-P23 (B3) Specifications Page 130

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5-20 Specifications
Copyright © 2003–2005 by LSI Logic Corporation. All rights reserved.
5.5 Package Drawings
The LSISAS1064 is packaged in a 472-EPBGA-T package with a
27 mm x 27 mm footprint and 1.0 mm ball pitch. The package code is
UO. The package drawing number is JZ02-000015-00. Figure 5.9
provides the package diagram for the LSISAS1064.
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